TDK Invensense

Wafer Level Packaging of MOEMS Solves Manufacturability Challenges In Optical Cross Connect

Published by TDK Invensense

This paper will examine the key packaging challenges in the fabrication of a 1000x1000 OXC, using MOEMS (micro-optical-electromechanical-systems) mirrors in 2N configurations.

It will describe how wafer-scale-integration (WSI) allowed for much greater simplification of the overall system and creation of the first fully integrated 3D MOEMS mirrors by Transparent Networks Inc. (TNI).

Another key enabling technology for making such high port count OXC was the ability to align thousands of optical fibers with their corresponding mirrors. This paper will examine the development challenges and TNI’s solution to this problem. 

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Related Categories Power, Electromechanical, Switches